Published 23 Nov 2011
Call for participants: Setting a SiC standard round robin
Take part in a SiC Round Robin To enable analysts to have confidence that their analytical equipment is working to specification, there is a need to set standards for known grades of Silicon Carbide (SiC) abrasives used by the wire saws when cutting out silicon wafers…READ MORE >
Tags: characterization, cutting, FPIA 3000, particle, shape